Frequently Asked Questions

RMW’s revolutionary technology offers significant cost reduction and significant advantages over traditional wire bonding materials including no oxidation, no shorts, relaxed design rules and unmatched scalability. Read more on the RMW Technology page.


Back to top

RMW glass coated copper wire performs similarly, and in some parameters, better than the industry benchmark gold bonding wire.

RED micro wires are insulated, composite wires made of a soft metal core and a high strength, ultra fine glass coating. RED wires are the ultimate in geometrical accuracy. The production process enables controlled solidification, creating a homogeneous alloy with an isotropic microstructure. The metal core is soft and the wire is deformation free. RMW’s innovative coating method is highly controlled and extremely accurate. The synergy between the coating and the soft core creates unmatched efficiency. RMW’s wire insulation dramatically improves material management in comparison to other types of bonding wires. RMW insulation protects the wire from problematic environmental effects, extends shelf life in room conditions significantly and prevents shorts in the bonding process.

Read more on the RMW Wire Comparison page.


Back to top

RMW is the sole proprietor of the technology used to develop our glass coated micro bonding wires for the semiconductor industry.


Back to top

No. RMW superior Cu wire properties are derived from the unique RMW technology and wire manufacturing process that produces wire with a soft metal core and an ultra thin, glass coating.


Back to top

RMW production process is unique and specifically for glass. It is the combination of the ultra thin glass coating and the soft metal core that creates the RMW unique wire properties. For the time being, other coating elements are not available.


Back to top

During FAB formation we have observed that the glass agglomerates to the neck region and leaves the bond interface almost free of glass, thus providing a good bond interface. In second bond formation we have observed that USG force opens the glass, revealing fresh and clean copper ready to be bonded to the device.


Back to top

Yes. As with all wire, RMW will perform best within a certain window of workability thus it is recommended to optimize to achieve best results.


Back to top

RMW is currently testing wire samples with technology partners. If you would like to test our wire please contact info@redmicrowire.com specifying your needs and we will get back to you shortly.


Back to top

The first RMW wire has a copper core, a composite of 20 micron copper core + 2 micron glass coating.


Back to top

Yes. RED micro wire is compatible with the existing tool infrastructure. RED Micro Wire has the ability to produce wire scaled down to the 4 micron diameter thus there may be a need for tool reconfiguration to handle the smaller diameters.


Back to top

RED micro wire is suitable for a variety of customers including:

  • Semiconductor assembly and packaging foundries
  • IDM’s with in-house assembly capabilities
  • LED / sensors / optics: OEM’s and ODM’s
  • Automotive industry

Back to top

Mass production will take place in Singapore, beginning Q4 2012, ramping up in Q1-Q2 2013.


Back to top

RMW is geared to answer market needs and will provide custom solutions per customer.


Back to top

Yes. RMW can produce wire with various types of metal cores including gold and silver. Our first wire has a copper core as this solution is suitable for the widest range of industry needs.


Back to top

Please contact info@redmicrowire.com specifying your needs and we will get back to you shortly.


Back to top

RED Micro Wire is backed by RED Equipment a market leader in providing secondary equipment for the semiconductor industry. RED Equipment made $50 in sales in 2011 and is continuing to grow. The management team consists of semiconductor veterans with 140 years collective experience. RED is a well established corporation with headquarters in Singapore and a global network of offices and operation centers in Asia-Pacific, EMEA, USA and Europe – uniquely positioning RED Equipment and RED Micro Wire to serve the semiconductor industry.


Back to top